Lantronix’s Open-Q™ 660 μSOM is an ultra-compact (50mm x 25mm) production-ready SOM based on the powerful Qualcomm® Snapdragon™ SDA660 SoC, with built-in Artificial Intelligence Engine, Spectra™ ISP, Kryo™ CPU, and Hexagon™ DSP. The feature-rich SOM will provide a leap in performance for applications requiring on-device artificial intelligence, advanced photography and image processing, or enhanced gaming.
In addition to the advanced Qualcomm SDA 660 SoC features, the SOM includes high-end Wi-Fi with 802.11ac 2×2 MU-MIMO, support for USB Type-C with 4K DisplayPort video out, a wealth of other I/O interfaces, and on-SOM power management and battery charging.
Processor
- Qualcomm® Snapdragon™ SDA660 built on 14nm FinFET technology
- Qualcomm® Octa-core Kryo™ 260 CPU with:
- 4 Kryo Gold High-performance 2.20GHz cores
- 4 Kryo Silver low-power 1.84GHz cores
- Qualcomm® Hexagon™ 680 DSP with Hexagon Vector eXtensions (dual-HVX512) 787 MHz
- Qualcomm® Adreno™ 512 GPU with 64-bit addressing at 650MHz
- OpenGL® 3.0/3.2, Vulkan® 1.1, DX12 FL 12, OpenCL™ 2.0 full profile
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Memory
- 4GB dual-channel high-speed LPDDR4X SDRAM at 1866MHz
- 32GB eMMC Flash in combo eMCP chip
Wireless
- Wi-Fi 802.11a/b/g/n/ac 2.4/5Ghz 2×2 MU-MIMO (WCN3990) with 5 GHz external PA & U.FL antenna connector
- Bluetooth 5.x
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LCD/touch Screen Interface
- 2x 4-lane MIPI DSI D-PHY 1.2, up to 2560 x 1600
- VESA DisplayPort V1.4, up to 4K30 or 2K60
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Camera Interface
- 3x 4-lane MIPI CSI combo D-PHY1.2
- Dedicated I2C controller for each camera port
- 2x camera flash control signals
- Dual 14-bit Qualcomm® Spectra™ ISP: 16 +16 MP, 540 MHz each
- 24MP30 ZSL with dual ISP; 16 MP 30 ZSL with a single ISP
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Audio
- 1x SLIMBus for external Qualcomm® Codecs
- 1x 4-lane, 1x 2-lane MI2S interfaces for external audio devices
- 2x digital microphone PDM interfaces
- 1x Soundwire interface for WSA8810/WSA8815 digital speaker amps
- Qualcomm™ Fluence™ HD (optional)
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Video
- Encode: 4K30 HEVC/H.264/VP8/MPEG4
- Decode: 4K30 8-bit: H.264/VP8/VP9, 4K30 10-bit: HEVC
- Concurrent: 1080p60 Decode + 1080p30 Encode
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I/O Interface
- 1x USB3.1 Gen1 Type-C, 1x USB 2.0 Host
- 4-bit SD 3.0, 8x BLSP ports (UART, I2C, SPI), configurable GPIOs
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Operating Environment
- Input 3.6V to 4.2V
- Operating Temperature: -25°C to +85°C Tc (component case temperature)
- 3x 100 pin board to board connectors
- 50mm x 25mm
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Power/Battery Management
- Power management and battery charging on SOM (PM660 and PM660L power management chips)
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OS Support
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Open-Q™ 660 µSOM Development Kit 
Lantronix’s Open-Q™ 660 µSOM Development Kit is a cost-effective, high performance, exposed board platform powered by the advanced Qualcomm® Snapdragon™ SDA660 processor on our ultra-small “micro SOM” form-factor.
The Development Kit is ideal for evaluation of the Open-Q™ 660 µSOM (Micro System on Module) as well as jump-starting development of advanced, intelligent, embedded and IoT products. It supports our optional Open-Q™ LCD / touch panel, optional 13MP camera module, and has many GPIO, sensor, audio, and other expansion interfaces.
Processor
- Qualcomm® Snapdragon™ SDA660, octa-core Kryo™ 260 CPU built on 14nm technology
- Qualcomm® Hexagon™ 680 DSP, Qualcomm® Adreno™ 512 GPU
- 4GB dual-channel high-speed LPDDR4X SDRAM at 1866MHz
- 32GB eMMC Flash in combo eMCP chip
- Wi-Fi 802.11a/b/g/n/ac 2.4/5Ghz 2×2 MU-MIMO (WCN3990) with 5Ghz external PA & U.FL antenna connector
- Bluetooth 5.x
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Camera
- Qualcomm® Spectra™ dual 14-bit ISP
- 3x MIPI CSI camera connectors for optional camera accessories
Optional Accessories
- Contact Macnica for More Details
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Audio
- Qualcomm® WCD9335 Audio Codec module on Carrier Board
- 1x Stereo headset jack with mic input
- 20pin Audio Input expansion header, 3x analog in, 3x digital in
- 20pin Audio Output expansion header, 5x analog out, 1x digital out
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Video
- Video Capture up to 4K at 30fps
- Video Playback 4K 30fps
- H.264 (AVC)
- VP8
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Operating Environment
- Input 12V/3A or single-cell Li-ion battery (not included)
- SOM size: 50mm x 25mm
- Carrier Board size: 170mm x 170mm Mini-ITX form factor with on-board mounting for optional LCD panel
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I/O
- 1x USB3.0 Type-C with DisplayPort video out, 1x USB2.0 Type-A Host, microSD card socket
- Multiple BLSP ports (GPIO, UART, SPI, I2C buses), Sensor header, LED driver outputs
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OS support
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Display
- 2x 4-lane MIPI DSI on display connector for optional LCD / Touch Panel to mount on carrier board
- VESA DisplayPort on USB Type-C connector, for up to 4K30 or 2K60 video output
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