Lantronix Open-Q™ 845 μSOM and Dev Kit

Lantronix’s Open-Q™ 845 μSOM is an ultra-compact (50mm x 25mm) production-ready SOM based on the powerful Qualcomm® Snapdragon™ SDA845 SoC, their latest and most powerful IoT chipset. With the 3rd-Gen Qualcomm® AI Platform, Spectra™ ISP, Kryo™ Octa-core CPU, Hexagon™ DSP, and a new dedicated secure processor, the 845 μSOM is ideal for powering the most advanced robotics, drones, cameras, and embedded IoT devices. In addition to the Open-Q 845’s impressive processing capabilities and on-device AI powers, it also includes new and improved I/O interfaces compared to previous Snapdragon™ generations — four camera ports, two USB3.1 ports (including 4K60 DisplayPort + concurrent SS data), and a Gen3 PCIe interface.

This powerful new hardware platform will be supported by your choice of full-featured Android or flexible Yocto Linux software.

Processor

  • Qualcomm® Snapdragon™ SDA845 built on 2nd-Gen 10nm technology
    • Qualcomm® Kryo™ 385 CPU: 4 Kryo Gold 2.649GHz cores + 4 Kryo Silver low-power 1.766GHz cores
    • Qualcomm® Hexagon™ 685 DSP with Hexagon Vector eXtensions (dual-HVX512)
    • Qualcomm® Adreno™ 630 GPU with OpenGL® RD 3.2 + AEP, DX next, Vulkan® 1.1, OpenCL™ 2.0 full profile

Video

  • Encode: 4K60 for H.264/H.265, 4K30 for VP8
  • Support for HDR 10-bit capture (HLG)
  • Decode: 4K60 H.264/H.265/VP9
  • Support for HDR 10-bit video playback (HLG, HDR10)

Memory

  • 4GB or 6GB dual-channel high-speed LPDDR4X SDRAM at 1866MHz
  • 32GB or 64GB UFS Flash Storage

Sensor Core Interface

  • SPI, I2C, GPIO connections to sensor core DSP

Wireless

  • Wi-Fi 802.11a/b/g/n/ac 2.4/5Ghz 2×2 MU-MIMO (WCN3990) with 5 GHz external PA & U.FL antenna connector
  • Bluetooth 5.x

OS Support

  • Android™ 9
  • Android™ 10
  • Linux OS based on Yocto Rocko

Display

  • 2x 4-lane MIPI DSI D-PHY 1.2, up to 3840 × 2400 10-bit 60 fps
  • VESA DisplayPort v1.4 on USB Type-C, up to 4K60 with USB data concurrency

Operating Environment

  • Input voltage: 3.5V to 4.7V
    Operating Temperature: -25°C to +85°C Tc (component case temperature)

Camera

  • 3x 4-lane MIPI CSI + 1x 2-lane MIPI CSI
  • Qualcomm® Spectra™ 280 ISP: 16 +16 + 2 MP sensor resolution
  • 32MP 30fps ZSL with dual ISP; 16 MP 30 ZSL with a single ISP

Audio

  • Dedicated audio DSP integrated with support for external WCD9340 codec and WSA8810/WSA8815 speaker amps
  • 1x SLIMBus interface for external Qualcomm® Codecs
  • 1x 4-lane MI2S interface + 2x 2-lane MI2S interfaces (muxed with SLIMBus) for other external audio devices

I/O Interfaces

  • 2 USB ports: 1x USB3.1 with support for Type-C + DisplayPort v1.4 with USB data concurrency, 1x USB 3.1
  • 1x PCIe Gen3 1-lane, 4-bit SD 3.0, UART, I2C, SPI, configurable GPIOs

Power/ Battery Management

  • Power management and battery charging solution on SOM
  • Qualcomm® PM845 + PM8998 + PM8005

Form Factor

  • 50mm x 25mm with 3x 100 pin board to board connectors

Open-Q™ 845 μSOM Development Kitintrinsyc-lantronix-open-q-845-devkit-front

Lantronix’s Open-Q™ 845 μSOM Development Kit is a versatile, easy-to-use, exposed board platform, powered by our ultra-compact, production-ready, Open-Q™ 845 μSOM. The Open-Q™ 845 μSOM is based on the powerful Qualcomm® Snapdragon™ SDA845 SoC, their latest and most powerful IoT chipset. With new processing capabilities, on-device AI powers, and generous I/O, the 845 μSOM is ideal for powering the most advanced robotics, drones, cameras, and embedded IoT devices.
The development kit provides the ideal starting point for evaluating the Open-Q™ 845 μSOM or developing next generation embedded and IoT devices. The platform consists of Lantronix’s Open-Q™ 845 μSOM, an open-frame carrier board exposing all the available I/O, and a range of accessories to fast track your product development.

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