Technology Solutions & Innovation Partner

ME10 System on Chip (SoC): Build complete AV/IP solutions with HDMI 2.0 4K 4:4: video/audio over 1GbE networks

Macnica: See how our experts can accelerate your robotics design.

ME10 SoC
Robotics
Sony IMX927
MEP100 Video

LATEST NEWS!

May 04, 2026
Macnica Americas Names Veteran Engineering Executive Nestor Amaya as Vice President of Engineering Macnica Americas has appointed Nestor Amaya as Vice President of Engineering. A 25-year veteran of broadcast, ProAV, and embedded technology infrastructure, Amaya joins from EVS Broadcast Equipment, where he served as Senior Vice President and led the North American region to become EVS's largest by revenue. Earlier in his career, he founded Coveloz Technologies, a FPGA and SoC engineering firm that was later acquired by Ross Video. In his new role, Amaya will oversee product strategy, engineering roadmaps, and solution delivery across Macnica Americas' key verticals, reporting to CEO Sebastien Dignard. His appointment deepens the company's component-to-solution capabilities across the Capture, Process, and Communicate value chain.
Mar 10, 2026
Macnica Showcases Partner Ecosystem Innovation on Ambarella’s N1 Platform with Live ISV Demonstrations at Embedded World 2026 Macnica today announced live demonstrations from two of its Macnica Imaging Ecosystem partners - iENSO and Hellbender - featuring next-generation Edge AI capabilities powered by Ambarella’s N1 platform. The demonstrations highlight agentic AI use cases running at the edge, powered by Ambarella’s N1-655 platform, showcasing the ability to run multi-billion-parameter AI models with exceptional performance per watt at low-power envelopes. Together, the demonstrations highlight how Macnica connects Ambarella’s silicon platform with ISV innovation to deliver complete Edge AI solutions - from capture and processing to actionable communication at the edge.

From Components to Solutions: Built to Move Innovation Forward.

Macnica Americas enables innovation across Robotics, AIoT, Automotive and Mobility, Broadcast and ProAV, and Medical and Healthcare by delivering integrated solutions across Capture, Process, and Communicate. By combining advanced sensors, AI and compute platforms, deterministic networking, and deep engineering expertise, we help customers reduce design risk and accelerate differentiated products to market.