IEI FLEX AIoT Developer Kit Gen. II

A Powerful Start for AI-based Projects

IEI has a smart platform for those looking to implement smart solutions such as Smart City, Smart Building, Smart Industry, or even Smart Medical systems.

The IEI FLEX AIoT Kit (Gen II) brings industrial strength powerful processing with Intel® Core™ and Xeon™ processors, redundant drives, rich IO, and slots for optional IEI accelerators. It’s all compatible with Intel’s OpenVINO toolset, libraries and models so developers get a head start on AI and Deep Learning projects.

Customers have found the IEI FLEX Kit to be solid and field-deployable.

2U AI Modular PC with 10th Generation LGA 1200 Intel^® Core™/Xeon^® processor with Intel^® Q470/W480 chipset and DDR4 memory
Four hot-swappable and accessible HDD drive bays support RAID 0/1/5/10
Support PCIe 3.0 by 4 and PCIe 3.0 by 8 slots
M.2 2280 PCIe 3.0 x4 NVMe™ SSD support
Dual independent display with high-resolution support
TPM data protection and reliable authentication
Support for optional Mustang-V100-MX8 PCIe Accelerator Card for offloading AI/DL workloads
Pre-installed Intel^® AC 9260 802.11 AC 2T/2R and Bluetooth V5.1

Integrate AI into IoT applications. It’s not that difficult

Open the door to faster deployments of inference systems with the IEI FLEX AIoT Developer Kit Gen. II via Intel® Distribution of OpenVINO™ toolkit & Intel® Media SDK.

Intel^® Distribution of OpenVINO™ toolkit

Intel^® Distribution of OpenVINO™ toolkit is based on convolutional neural networks (CNN); the toolkit extends workloads across multiple types of Intel^® platforms and maximizes performance.

It can optimize pre-trained deep learning models such as Caffe, MXNET, and Tensorflow. The tool suite includes more than 20 pre-trained models, and supports 100+ public and custom models (including Caffe, MXNet, TensorFlow, ONNX, Kaldi) for easier deployments across Intel^® silicon products (CPU, GPU/Intel^® Processor Graphics, FPGA, VPU).

intel open vino

Hardware Features

FLEX hardware features

Specifications

Model	FLEX-BX210AI-Series
System
CPU	Intel^® Xeon^® W-1290TE 1.8GHz (up to 4.5GHz, 10-core, TDP 35W) Intel^® 10th Generation Core™ i9-10900TE 1.8GHz (up to 4.5GHz, 10-core, TDP 35W) Intel^® 10th Generation Core™ i5-10500TE 2.3GHz (up to 3.7GHz, 6-core, TDP 35W)
Chipset	Intel^® 400 Series Chipsets (Comet Lake)
Memory	2 x 288-pin 2933/2666 MHz dual-channel DDR4 unbuffered DIMM supporting up to 64GB Xeon W with 32GB RAM Pre-installed Core i9 with 16GB RAM Pre-installed Core i5 with 8GB RAM Pre-installed
Graphics Engine	Intel^® HD Graphics Gen 9.5 Engines with Low power 16 execution unit, supports DX2015, OpenGL 5.X and OpenCL2.x, ES 2.0
Ethernet	LAN1: Intel^® I219LM with Intel^® AMT 11.0 supported LAN2/LAN3: Intel^® I210 PCIe controller
Storage
Storage	4 x accessible 2.5” HDD/SSD SATA 6 Gb/s bay (with RAID 0/1/5/10 support) with LED indicator 1 x NGFF M.2(2280) M Key socket (support NVMe SSD) Pre-installed 1 x 2.5” 1TB HDD
Wireless Communication
WLAN	Intel^® AC 9260 802.11ac, 2.5/5GHz, 2T/2R (by M.2 2230)
Bluetooth	Bluetooth V5.1
WWAN and GNSS	M.2 3042 LTE (optional)
I/O Ports and Switches
I/O Ports and Switches	1 x Display port output 1 x HDMI output 3 x GbE LAN (1x I219 support vPro, 2x I210) 6 x USB 3.2 Gen1 Type-A 2 x RS-232 DB-9 1 x Mic in 1 x Line out 1 x AC inlet 4 x SMA Power button with power LED (power on=Blue) AT/ATX mode switch Reset button
TPM	TPM 2.0 (pre-installed)
Expansion Slots
Expansion Slots	2 x PCIe 3.0 x8 2 x PCIe 3.0 x4 1 x M.2 B-Key 2242 socket (with SIM slot for 3G/LTE, supports PCIe 3.0 x1 & USB 3.2 Gen1) 1 x M.2 M-Key 2280 socket (supports PCIe 3.0 x4)
Thermal Solution
Thermal Solution	3 x System fan, 1 x CPU cooler
Power supply
Power supply	AC input ATX power supply - 350W Power supply - Input: 90VAC~264VAC, 50/60Hz - Output (max.): 3.3V@14A, 5V@16A, 12V@29A, -12V@0.3A
Watchdog Timer
Watchdog Timer	Software programmable support 1~255 sec. system reset
Construction
Chassis Construction	Metal housing
Mounting	Wall/Rack mount
Color	Black
Dimensions (LxDxH) (mm)	357 x 230 x 88
Net Weight	4 kgs
Environmental
Operating Temperature	-10°C ~ 50°C
Storage Temperature	-20°C ~ 60°C
Operating Humidity	5% ~95%, non-condensing
Vibration	5~17Hz, 0.1 double amplitude displacement 17~640Hz 1.5G acceleration peak to peak
Shock	10G acceleration part to part (11ms)
Safety/EMC	CE/FCC/RoHS

Ordering Information

Part No.	Description
With Mustang-V100-MX8
FLEX-BX210AI-XE/32G/V-R10	2U AI Modular box PC, Intel^® Xeon^® W-1290TE 1.8GHz (up to 4.5GHz, 10-core, TDP 35W), 32GB DDR4, 2.5” 1TB HDD, TPM 2.0, 350W PSU, with Mustang-V100-MX8, Wi-Fi 802.11ac, R10
FLEX-BX210AI-i9/16G/V-R10	2U AI Modular box PC, Intel^® 10th Generation Core™ i9-10900TE 1.8GHz (up to 4.5GHz, 10-core, TDP 35W), 16GB DDR4, 2.5” 1TB HDD, TPM 2.0, 350W PSU, with Mustang-V100-MX8, Wi-Fi 802.11ac, R10
FLEX-BX210AI-i5/8G/V-R10	2U AI Modular box PC, Intel^® 10th Generation Core™ i5-10500TE 2.3GHz (up to 3.7GHz, 6-core, TDP 35W), 8GB DDR4, 2.5” 1TB HDD, TPM 2.0, 350W PSU, with Mustang-V100-MX8, Wi-Fi 802.11ac, R10
Without Mustang-V100-MX8
FLEX-BX210AI-XE/32G-R10	2U AI Modular box PC, Intel^® Xeon^® W-1290TE 1.8GHz (up to 4.5GHz, 10-core, TDP 35W), 32GB DDR4, 2.5” 1TB HDD, TPM 2.0, 350W PSU, Wi-Fi 802.11ac, R10
FLEX-BX210AI-i9/16G-R10	2U AI Modular box PC, Intel^® 10th Generation Core™ i9-10900TE 1.8GHz (up to 4.5GHz, 10-core, TDP 35W), 16GB DDR4, 2.5” 1TB HDD, TPM 2.0, 350W PSU, Wi-Fi 802.11ac, R10
FLEX-BX210AI-i5/8G-R10	2U AI Modular box PC, Intel^® 10th Generation Core™ i5-10500TE 2.3GHz (up to 3.7GHz, 6-core, TDP 35W), 8GB DDR4, 2.5” 1TB HDD, TPM 2.0, 350W PSU, Wi-Fi 802.11ac, R10

Don't Forget to Ask About IEI's Accelerators for the FLEX Kit

About IEI Integration Corporation

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Industrial and medical computing and network products and instruments, embedded boards and systems, as well as AI and edge processing solutions. With several award winning solutions, IEI has demonstrated leadership in the market. They have alliances with Intel®, Microsoft® and Amazon for their leading edge technology.