Starterkit STKxE39C2 | Macnica Americas

Based on TQMxE39C2 Intel Atom® x5/x7 E3900 Apollo Lake-I

The Embedded Starterkit STKxE39C2 is an evaluation kit tailored for embedded computing engineers. Built on the TQMxE39C2 platform, it features Intel Atom® x5/x7 E3900 processors (Apollo Lake-I). This kit stands out with its triple display support for DP/HDMI (up to 4K UHD) and eDP/LVDS interfaces, providing impressive visual capabilities. It's powered by dual/quad-core processors running at speeds up to 2.5 GHz, making it a suitable choice for real-time computing, industrial automation, digital surveillance, and more. This module complies with the international PICMG standard COM Express® Compact (COM.0 R2.1) with a type 6 pinout. It integrates the latest Intel® graphics processor, delivering high-resolution graphics, 3D processing, and robust video encoding and playback.

Features

Triple Display Support: Employs DP/HDMI (4K UHD) and eDP/LVDS interfaces for triple display support.
Dual/Quad-Core Processors: Powered by processors with speeds of up to 2.5 GHz for high performance.
High-Speed Gigabit Ethernet: Facilitates efficient, high-speed network communication.
Robust Design: Designed to withstand challenging environments and conditions.
Custom Configuration: Features a board controller that supports thermal management and offers flexibility in configuration.

Specifications

CPU	Intel Atom® x5/x7 E3900 (Apollo Lake-I) x5-E3930 2x 1.3/1.8 GHz, 6.5 W x5-E3940 4x 1.6/1.8 GHz, 9.5 W x7-E3950 4x 1.6/2.0 GHz, 12 W Celeron® N3350 2x 1.1/2.4 GHz, 6 W Pentium® N4200 4x 1.1/2,5 GHz, 6 W
Memory	DDR3L - 4/8 GB eMMC - 8-64 GB
Graphics	2x Digital Display Interface (DDI) for DP 1.2a, HDMI 1.4b 1x eDP 1.4/Dual Channel LVDS
Communications Interfaces	Ethernet - 1x Gigabit Ethernet (Intel i210) USB - 3x USB 3.0 \| 5x USB 2.0
Other Interfaces	PCIe - 4x PCIe 2.0 LPC - LPC/eSPI I2C SMBus SPI - SPI (for external UEFI BIOS flash) Audio - Intel HD Audio GPIO - 8x GPIO SD Card - 1x SD Card
General	Dimensions - 95mm x 95mm Plug-in System - COM Express Compact, Type 6 Temperature range - Standard temperature: 0°C…+60°C Power supply - 4.75 V - 20 V / 4.75 V - 20 V Standby (optional) / 3 V Battery for RTC Power consumption - typ. 3 - 8 W/max. 14 W (Green ECO-Off: < 0.1 W)

Ordering Information

TQMxE39C2-AA (“Premium“)	Intel Atom x7-E3950 (4x 1.6/2.0GHz, 2MB Cache, 12W TDP), 2x SO-DIMM socket, 0GB eMMC, LVDS, SDCard, Standard-Temp. 0..+60°C
TQMxE39C2-AB (“Mainstream“)	Intel Atom x5-E3940 (4x 1.6/1.8GHz, 2MB Cache, 9.5W TDP), 2x SO-DIMM socket, 0GB eMMC, LVDS, SDCard, Standard-Temp. 0..+60°C
TQMxE39C2-AC (“Entry“)	Intel Atom x5-E3930 (2x 1.3/1.8GHz, 2MB Cache, 6.5W TDP), 2x SO-DIMM socket, 0GB eMMC, LVDS, SDCard, Standard-Temp. 0..+60°C
TQMxE39C2-AD (“Celeron”)	Intel Celeron N3350 (2x 1.1/2.4GHz, 2MB Cache, 6W TDP), 2x SO-DIMM socket, 0GB eMMC, LVDS, SDCard, Standard-Temp. 0..+60°C
TQMxE39C2-AE (“Pentium”)	Intel Pentium N4200 (4x 1.1/2.5GHz, 2MB Cache, 6W TDP), 2x SO-DIMM socket, 0GB eMMC, LVDS, SDCard, Standard-Temp. 0..+60°C
Evaluation platform MB-COME6-1	Mainboard for COM Express™ Compact/Basic, Type 6 Interfaces: 2x DP++, eDP/LVDS, 2x Gb ethernet, 2x USB 3.0, 3x USB 2.0, 3x COM, audio, mini PCIe, mSATA, 2,5“ SSD, CFast, riser extension with 2x PCIe and USB, fan, debug, 170 mm x 170 mm

TQ Embedded is known for:

Precision German engineering, now with a North America presence
- Robust industrial products with support
Widest portfolio of embedded processing architectures: ARM, x86, PowerPC
Comprehensive in-house process and facilities for true long-life availability
Modules with full signal availability (ALL signals available, not just selective groups)
In-house full control: design, manufacturing, specialized adaptations
Robust baseboard options, production-ready for mounting their SOM products

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