Starterkit STKxE39M | Macnica Americas

Based on TQMxE39M Intel Atom® x5/x7 E3900 Apollo Lake-I

The Embedded Starterkit STKxE39M is an evaluation kit designed for embedded computing engineers. It is built upon the TQMxE39M platform, featuring Intel Atom® x5/x7 E3900 processors (Apollo Lake-I). This kit offers high-speed connectivity through Gigabit Ethernet, robust design with protective coating options, and support for triple displays with DP/HDMI (up to 4K UHD) and eDP/LVDS interfaces. Equipped with dual/quad-core processors, capable of speeds up to 2.5 GHz, the TQ module is designed for real-time computing, industrial automation, surveillance, aviation, medical, and retail applications. It follows the COM Express® Mini standard and offers 8 USB ports, including 2x USB 3.0, and up to 4 PCIe lanes natively supported by the processor.

Features

High-Speed Gigabit Ethernet: Facilitates efficient and high-speed network communication.
Robust Design: Designed for rugged applications with protective coating options.
Triple Display Support: Allows up to three displays with DP/HDMI (4K UHD) and eDP/LVDS interfaces.
Dual/Quad-Core Processors: Equipped with processors capable of speeds up to 2.5 GHz for diverse computing tasks.
Flexible Connectivity: Features 8 USB ports, including 2x USB 3.0, and up to 4 PCIe lanes for high-bandwidth communication.

Specifications

CPU	Intel Atom® x5/x7 E3900 (Apollo Lake-I) x5-E3930 2x 1.3/1.8 GHz, 6.5 W x5-E3940 4x 1.6/1.8 GHz, 9.5 W x7-E3950 4x 1.6/2.0 GHz, 12 W Celeron® N3350 2x 1.1/2.4 GHz, 6 W Pentium® N4200 4x 1.1/2,5 GHz, 6 W
Memory	DDR3L - non-ECC, Dual Channel EEPROM - 32kbit eMMC - 4-64 GB
Graphics	1x Digital Display Interface (DDI) for DP 1.2a, eDP 1.3, HDMI 1.4b 1x eDP1.4/Single Channel LVDS (also usable for second external monitor)
Communications Interfaces	Ethernet - 1x Gbit Ethernet USB - 2x USB 3.0 \| 6x USB 2.0 Serial Ports: 2x Serial port
Other Interfaces	PCIe - 4x PCIe 2.0 LPC - LPC/eSPI I2C SMBus SPI - SPI (for external UEFI BIOS flash) Audio - Intel HD Audio GPIO - 8x GPIO through TQ-flexiCFG SD Card - 1x SD Card interface
General	Dimensions - 84mm x 55mm Plug-in System - COM Express Mini, type 10 Temperature range - Standard temperature: 0°C…+60°C (HE versions) Power supply - Voltage: 4.75 V - 20 V / 4.75 V - 20 V Standby (optional) / 3 V Battery for RTC Power consumption - typ. 3 - 8 W/max. 14 W (Green ECO-Off: < 0.1 W)

Ordering Information

TQMxE39M-AA	Intel Atom® x7-E3950 (4x 1.6/2.0GHz, 2MB Cache, 12 W TDP), 4GB DDR3L, 32 GB eMMC, eDP, Industrial-Temp. -40..+85°C
TQMxE39M-AB	Intel Atom® x5-E3940 (4x 1.6/1.8GHz, 2MB Cache, 9.5 W TDP), 4GB DDR3L, 16 GB eMMC, LVDS, Industrial-Temp. -40..+85°C
TQMxE39M-AC	Intel Atom® x5-E3930 (2x 1.3/1.8GHz, 2MB Cache, 6.5 W TDP), 2GB DDR3L, eDP, Standard-Temp. 0..+60°C
TQMxE39M-AD	Intel® Celeron® N3350 (2x 1.1/2.4GHz, 2MB Cache, 6 W TDP), 2GB DDR3L, eDP, Standard-Temp. 0..+60°C
TQMxE39M-AF	Intel® Pentium® N4200 (4x 1.1/2.5GHz, 2MB Cache, 6 W TDP), 4GB DDR3L, LVDS, Standard-Temp. 0..+60°C
MB-COME10-1	Mainboard for COM Express™ Minimodules, Type 10 Interfaces: DP, eDP/LVDS, 2x Gb Ethernet, 4x USB, 3x COM, audio, mini PCIe, mSATA, 2.5“ SSD, SD card, riser extension with PCIe and USB, fan, debug, 170 mm x 170 mm

TQ Embedded is known for:

Precision German engineering, now with a North America presence
- Robust industrial products with support
Widest portfolio of embedded processing architectures: ARM, x86, PowerPC
Comprehensive in-house process and facilities for true long-life availability
Modules with full signal availability (ALL signals available, not just selective groups)
In-house full control: design, manufacturing, specialized adaptations
Robust baseboard options, production-ready for mounting their SOM products

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