Intel Agilex 7 FPGA and SoC Overview

The Altera Agilex 7 devices include the industry’s highest performance FPGAs providing a range of premium features for the most demanding applications, including the F-Series, I-Series, and M-Series. This tier offers the industry’s highest data rate transceivers—up to 116 Gbps—the first PCIe 5.0 and CXL support, and options to integrate in-package HBM2E memory delivering the industry’s highest memory bandwidth (over 1 TBps). These capabilities enable customized connectivity and acceleration for the most compute, bandwidth, and memory-intensive use cases in communications, data center, defense, high-performance computing, video, high-end test/measurement/medical, and more.

F-Series FPGAs and SoCs	I-Series FPGAs and SoCs	M-Series FPGAs and SoCs

F-Series devices are general purpose FPGAs built on Altera 10 nm SuperFin process technology. With features including transceiver rates up to 58 Gbps, advanced digital signal processing (DSP) blocks supporting multiple precisions of fixed-point and floating-point operations.	I-Series devices offer the highest performance I/O interfaces to address bandwidth-intensive applications. Manufactured on Altera 10 nm SuperFin process technology, this series builds upon the F-Series device features offering transceiver rates up to 116 Gbps, PCIe 5.0 support, and cache- and memory-coherent attach to processors with CXL.	M-Series devices are optimized for compute and memory-intensive applications. Leveraging Altera 7 process technology, this series builds upon I-Series device features offering an extensive memory hierarchy including integrated high-bandwidth memory (HBM) and high-efficiency interfaces

Highlights

Performance and Efficiency

Industry-leading FPGA architecture
Advanced 7 nm process technology
Enhanced logic fabric performance
Power-efficient design options

Versatile Connectivity

High-speed transceivers up to 116Gbps
PCIe 5.0 and Compute Express Link (CXL) support
Integrated Arm-based processors
Broad range of I/O interfaces

Intel Agilex 7 efficient network transformation infographic

Infrastructure Offload

Optimized Architecture

Converged Workload Acceleration for the data center infographic

Infrastructure Processing Unit (IPU)
vRouter
Security

Small Form Factor and Low Power

Wide range of servers

Infrastructure Acceleration

Network
Security
Remote memory access

Application Acceleration

Artificial Intelligence (AI)
Search
Video transcode
Database
38 TFLOPs of DSP performance

Storage Acceleration

Compression
Decompression
Encryption
Memory hierarchy management

Custom Logic Continuum

FPGA Flexibility

Agilex 7 and Flexibility for all stages of 5g implementation infographic

High Flexibility
Short time to market

Rapid Altera eASIC Device Optimization

Power and cost optimization

Full Custom ASIC Optimization

Best power
Best Performance
Best Cost

Application-Specific Tile Options

Data converter
Vector engine
Custom compute

Acceleration and Analytics

In-line protocol acceleration
Look-aside application acceleration

Safety and Security

Secure boot
Encryption
Authentication

Customized Connectivity

Time-sensitive networks
Flexible I/O

smart safe and secure factory acceleration

Altera Agilex® 7 FPGAs and SoCs Summary of Features

Feature		Description
Packaging		Altera Embedded Multi-die Interconnect Bridge (EMIB) packaging technology Multiple devices with identical package footprints allow seamless migration across different device densities Mixture of ball pitch FBGA packages, 1,025 mm, 0.92 mm, and several mixed pitch packages
High performance core fabric		Second Generation Altera® Hyperflex™ core architecture with Hyper-Registers throughout the interconnect routing and at the inputs of all functional blocks Enhanced adaptive logic module (ALM) Improved multi-track routing architecture reduces congestion and improves compile times Hierarchical core clocking architecture with programmable clock tree synthesis Fine-grained partial reconfiguration
Internal memory blocks		Multi-level on-chip memory hierarchy M20K—20 kilobits with hard error correction code (ECC) support MLAB—640-bit distributed LUTRAM
Internal memory blocks		F-Series I-Series	eSRAM—18 Mb embedded memory block with hard ECC support
Variable precision DSP blocks		Variable precision DSP blocks with hard IEEE 754-compliant floating-point units, including support for: Single-precision FP32 (32-bit arithmetic) Half-precision FP16 (16-bit arithmetic) floating point modes Tensor floating point FP19 (19-bit arithmetic) floating point modes BFLOAT16 floating-point format Supports signal processing with precision ranging from 9×9 up to 54×54 Native 27×27, 18×19, and 9×9 multiplication modes 64-bit accumulator and cascade for systolic finite impulse response (FIR) filters Internal coefficient memory banks Pre-adder/subtractor improves efficiency 2× additional pipeline register increases performance and reduces power consumption
Core clock networks		Programmable clock tree synthesis—backwards compatible with global, regional and peripheral clock networks Synthesize clocks where needed only—minimizes dynamic power
		F-Series I-Series	800 MHz LVDS interface clocking—supports 1,600 Mbps LVDS interface through the 1.5 V True Differential Signaling (TDS) standard compatible with LVDS, RSDS, mini-LVDS, and LVPECL standards 1,600 MHz external memory interface clocking, supports 3,200 Mbps DDR4 interface
		M-Series	800 MHz LVDS interface clocking—supports 1,600 Mbps LVDS interface through the 1.3 V TDS standard compatible with LVDS, RSDS, mini-LVDS, and LVPECL standards 2,800 MHz external memory interface clocking, supports 5,600 Mbps DDR5 interface
General purpose I/Os	General	Over 700 total GPIOs available On-chip termination (OCT)
		F-Series I series	1.6 Gbps 1.5 V TDS compatible with LVDS, RSDS, mini-LVDS, and LVPECL standards 1.2 V single-ended LVCMOS/LVTTL interfacing
		M-Series	1.6 Gbps 1.3 V TDS compatible with LVDS, RSDS, mini-LVDS, and LVPECL standards 1.05 V, 1.1 V, and 1.2 V single-ended single-ended LVCMOS/LVTTL interfacing
	External memory interface (Hard IP)	F-Series I-Series	1,600 MHz (3,200 Mbps) DDR4 external memory interface
	External memory interface (Hard IP)	M-Series	1,600 MHz (3,200 Mbps) DDR4 external memory interface 2,800 MHz (5,600 Mbps) DDR5 external memory interface 2,750 MHz (5,500 Mbps) LPDDR5 external memory interface
Phase locked loops (PLL)	I/O PLL	Integer PLLs adjacent to general purpose I/Os Precision frequency synthesis Clock delay compensation Zero-delay buffering Support external memory and LVDS-compatible interface
Phase locked loops (PLL)	Transmit PLLs (TX PLLs)	Precise fractional synthesis Ultra low jitter with LC tank-based PLL Supports transceiver interfaces
Memory controller support		Multiple hard IP instantiations in each device
		F-Series I-Series	DDR4 hard memory controller QDR IV using soft memory controller
		M-Series	DDR5/LPDDR5/DDR4 hard memory controller QDRIV support using soft memory controller Hard memory network-on-chip (NoC)
High-bandwidth memory		M-Series	In-package HBM2E memory options Up to 32 GB of high bandwidth memory
Memory NoC		M-Series	Hardened memory network-on-chip (NoC) enabling high bandwidth data flow between the FPGA fabric and the NoC-attached memories without using FPGA resources Supports over 1 TBps of aggregate memory bandwidth
High-performance crypto blocks⁴		Supports AES and SM4 encryption standards Supports GCM and XTS modes of operation
Transceivers	PCIe*	P-Tile F-Tile	PCIe* rates up to PCIe* 4.0, 16 Gbps NRZ
	PCIe*	R-Tile	PCIe* rates up to PCIe* 5.0, 32 Gbps NRZ Compute Express Link* ( CXL* ) support
	Networking	E-Tile	Continuous operating range of 1 Gbps to 28.9 Gbps NRZ and 2 Gbps to 58 Gbps PAM4 Insertion loss compliant to 802.3bj, CEI 25G-LR, and CEI 56G-LR Oversampling capability for data rates below 1 Gbps ATX transmit PLLs (LC-PLL) with user-configurable fractional synthesis capability XFP, QSFP-DD, OSFP, QSFP or QSFP28, QSFP56, SFP+, SFP28, SFP56, and CFP or CFP2 or CFP4 optical module support Adaptive linear and decision feedback equalization Transmit pre-emphasis and de-emphasis Dynamic partial reconfiguration of individual transceiver channels On-chip instrumentation (Eye Viewer non-intrusive data eye monitoring)
	Networking	F-Tile	General purpose transceiver block (FGT) with continuous operating range of 1 Gbps to 32 Gbps NRZ and 20 Gbps to 58 Gbps PAM4 High speed transceiver block (FHT) with operating ranges of: 24 Gbps to 29 Gbps NRZ and PAM4 48 Gbps to 58 Gbps NRZ and PAM4 96 Gbps to 116 Gbps PAM4 The F-Tiles in these devices have the following transceivers: I-Series—FHT and FGT transceivers M-Series—FHT and FGT transceivers F-Series—FGT transceivers only
Transceiver hard IP	PCIe*	Multiple hard IP instantiations in each device
		P-Tile F-Tile	Up to PCIe* 4.0 ×16 EP and RP Port bifurcation support: 2×8 endpoint or 4×4 root port TL bypass feature Single-root I/O virtualization (SR-IOV): 8 physical functions or 2K virtual functions VirtIO support Scalable IOV Shared virtual memory
		R-Tile	Up to PCIe* 5.0 ×16 EP and RP Port bifurcation support: 2×8 endpoint or 4×4 root port TL bypass Feature SR-IOV: 8 physical functions or 2K virtual functions VirtIO support Scalable IOV Shared Virtual Memory PIPE Direct mode Precise Time Management
	CXL*	R-Tile	Up to PCIe* 5.0 ×16 EP Selected features support CXL* 1.1 and 2.0 specifications Soft logic (encrypted) to support CXL* Type 1, Type 2, or Type 3 devices Mix and manage different memory types and controllers
	Other protocols	E-Tile	Ethernet IP configurations: 24× 10 or 25 GbE MAC, PCS, and RS-FEC 4× 100 GbE MAC, PCS, and RS-FEC CPRI and fibre channel FECs CR/KR (AN/LT) 1588 PTP MAC, PCS, and FEC bypass options PMA Direct Mode
	Other protocols	F-Tile	Ethernet IP Configurations: 16× 10 or 25 GbE MAC, PCS, and FEC 8× 50 GbE MAC, PCS, and FEC 8× 40 GbE MAC, PCS, and FEC 4× 100 GbE MAC, PCS, and FEC 1× 400 GbE MAC, PCS, and FEC KP FEC support Flex-O FEC, FlexE PCS and FEC, Ethernet over OTN Mode, SyncE, fibre channel, and CPRI FEC CR/KR (AN/LT) 1588 PTP MAC, PCS, and FEC bypass options PMA Direct Mode
Configuration		Dedicated SDM Software-programmable device configuration Fine-grained partial reconfiguration of core fabric—add or remove system logic while the device is operating Dynamic reconfiguration of transceivers and PLLs PUF service Platform attestation Anti-tamper features
		F-Series	Serial and parallel flash interface Configuration via protocol (CvP) using PCIe* 1.0, 2.0, 3.0, or 4.0 Comprehensive set of security features including AES-256, SHA-256/384, ECDSA-256/384 accelerators, and multi-factor authentication
		I-Series M-Series	Serial and parallel flash interface Configuration via protocol (CvP) using PCIe* 1.0, 2.0, 3.0, 4.0, or 5.0 Comprehensive set of security features including AES-256, SHA-256/384, ECDSA-256/384 accelerators, and multi-factor authentication
Software and tools		Altera ® Quartus® Prime Pro Edition design suite with new compiler and Hyper-Aware design flow New compile innovations in each Altera® oneAPI release Transceiver toolkit Platform Designer IP integration tool Altera® DSP Builder for Intel® FPGAs advanced blockset Arm* Development Studio for Altera® SoC FPGA (Arm* DS for Altera® SoC FPGA)

Altera Agilex 7 FPGA and SoC Overview

F-Series FPGAs and SoCs

I-Series FPGAs and SoCs

M-Series FPGAs and SoCs