Lantronix Open-Q™ 2290 Series SIP

The design is based on the Qualcomm® QCS2290, with on-board audio codec, 2GB of LPPDR4 memory, 16GB of eMMC, pre-certified Wi-Fi and Bluetooth. It is an entry-tier solution that delivers greater performance, graphic, camera capabilities, and improved power performance. It is a 35 x 35mm LGA package that is ideal for industrial IoT applications such as handhelds, panels, POS/kiosks, vending machines, exercise equipment, and camera applications.

Along with the companion development kit, OS and SDKs, and available accessories, the Qualcomm® QCS2290 will accelerate your time to market for innovative new products requiring advanced imaging and computer vision performance in low-cost and low-power embedded situations.

Customer Benefits

  • Entry-tier solution that delivers greater performance, graphic, camera capabilities, and improved power
  • performance.
  • Scalable volume deployment through future ConsoleFlow™ support for device management, zero-touch provisioning
  • and OTA updates of functionality and security
  • Secure compute platform
  • Long device life cycle

Target Markets

  • Industrial IoT applications including handhelds and panels
  • Camera applications
  • POS/kiosk, vending machines, exercise equipment displays
  • Entry-level robotics including warehouse and logistics

Open-Q™ 2290 Series SIP Tech Specs

Product Name Open-Q™ 2290CS SIP
Chipset QCS2290
Memory 2GB LPDDR4
Storage 16GB eMMC
External Storage uSD
Wi-Fi / BT 802.11 a/b/g/n/ac, 1×1; BT 5.0 with WCN3950
Location Support with external GNSS circuitry and WGR7640. Please contact us for more details.
Gen 9, GPS, Glonass, BeiDou, Galileo, QZSS, and SBAS.
NavIC support with WGR7640
Modem None
Display Interfaces One 4-lane; DSI D-PHY 1.2. Split link supported
Adreno 702 at 845 MHz
OpenGL ES 3.1, Vulkan 1.1, OpenCL 2.0
HD+ (1680×720) @ 60 fps
Camera Interfaces 2x 4-lane MIPI CSI
Two cameras: 13 MP +13 MP @ 30fps
One camera: 25MP @ 30fps
Video capabilities 1080p 30 fps encode / 1080p 30fps decode
AI Capability (TOPs)  
Audio 4 x DMIC, support for two voice activation engines, integrated low power island for voice activation, supports always-on noise suppression
I/O USB 3.1 Type C, SDIO, UART, SPI, I2C, I3C, GPIO
PCIe None
Battery Charger Yes
Operating Temperature Extended (-25C to 85C)
Form Factor SIP (LGA)
Dimensions 35 x 35 x 2.8mm
Software Android 12 Go
Certification FCC, RED

 

Ordering Information

Lantronix Part # Name Description  
SIP
QC-SIP-2290CS-A Open-Q™ 2290CS SIP Open-Q™ 2290CS SIP (2GB/16GB), Android 12 Go  
Development Kit
QC-DK-AL1 Fully Assembled Development Kit

 

  • Compatible with Open-Q™ 2200 SIP Series
  • Pre-assembled
  • QC-SIP-CONN-2290CS-A
  • Open-Q™ AL2 Main board
  • Open-Q™ AL2 Vision Kit with Nav Mezzanine Board, OV05A10 Main Camera and OV9282 Tracking Camera
  • 5.45" TFT LCD, 720 x 1440 dots, touch screen

 

 
SIP on Interposer Boards
QC-SIP-CONN-2290CS-A Open-Q™ 2290CS-A SIP on Interposer Board Open-Q™ 2290CS-A SIP (2GB/16GB) on Interposer Board with B2B Connectors, Android 12 Go  

For more information: