A 1.0 mm x 1.0 mm stacked CMOS image sensor built for the endoscope tip. Macnica SLVS-EC receiver IP and the IMX742 Bridge Chip carry its image data over long, thin cables to FPGA-based host systems, cutting development effort for single-use endoscope designers.
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| Value | 1.0 x 1.0 mm | 720 x 720 | 60 fps | Up to 5 m | 6 pins |
|---|---|---|---|---|---|
Label | Chip size | Effective pixels | At full resolution | Signal drivability | Total pin count |
The Sony IMX742 is a 3D-stacked CMOS image sensor designed for single-use endoscope cameras. Its 1.0 mm x 1.0 mm wafer-level package delivers 720 x 720 resolution at 60 frames per second and needs only six pins. A bidirectional one-wire control interface and an SLVS-EC based output keep the pin count low while carrying image data across up to 5 m of cable. An internal oscillator removes the need for an external clock.
That reach matters. Longer, thinner scopes open procedures where reusable instruments are hardest to clean, from the duodenum to the deep lung. Moving high-speed image data reliably across a long, narrow cable calls for a receiver designed specifically for SLVS-EC.
Macnica has worked with the SLVS-EC interface for more than ten years. Our SLVS-EC receiver IP and IMX742 Bridge Chip connect the sensor to Altera FPGA-based host systems and convert its output to standard MIPI CSI-2, so design teams can focus on the console, the optics and the clinical workflow.
$4.94B Projected disposable endoscope market by 2030, growing at a 7.6% CAGR as hospitals act to eliminate cross-infection risk and remove reprocessing from the exam workflow.
Source: Grand View Research, Disposable Endoscopes Market Analysis, 2024
Sony packs high sensitivity, low noise and a minimal interface into a sensor small enough for the narrowest scope tips.
3D-stacked architecture
Stacked CMOS image sensor technology delivers high image quality and added functionality in a very small chip.
Back-illuminated pixels
A 1.0 µm back-illuminated pixel provides high sensitivity in the low-light conditions inside the body.
Column A/D conversion
Column-parallel analog-to-digital conversion supports high-speed readout with low noise.
Cavity-less WLCSP
Wafer-level chip scale packaging achieves a 1.0 mm x 1.0 mm footprint for ultra-compact camera modules.
Bidirectional one-wire control
A new bidirectional interface saves pins while maintaining stable, high-speed communication with the host.
Long-reach SLVS-EC output
An SLVS-EC based digital output resists noise and drives signals up to 5 m, enabling longer, thinner endoscope designs.
| Item | IMX742 |
|---|---|
| Wafer process | 3D-stacked structure |
| Chip size | 1.0 mm x 1.0 mm |
| Package | WLCSP |
| Number of pins | 6 |
| Effective pixels | 720 (H) x 720 (V) |
| Pixel size | 1.0 µm x 1.0 µm |
| Color filter | Bayer color |
| Chief ray angle (CRA) | 32° |
| Frame rate | 60 fps at full resolution |
| Output bit depth | 10-bit |
| Shutter | Rolling shutter, global reset (global reset requires pulsed illumination) |
| Readout modes | 2 x 2 binning, vertical window output |
| Control interface | Bidirectional one-wire communication |
| Output interface | SLVS-EC based |
| Clock input | Not required (internal oscillator) |
| Power supply | 2.7 V, 1.1 V, -1.2 V |
| Signal drivability | Up to 5 m |
Application | Single-use endoscope cameras |
Specifications are preliminary and subject to change. Refer to Sony Semiconductor Solutions for the latest information.
The IMX742 puts a new interface at the end of a long cable. Macnica closes the gap between that sensor and your host processor with FPGA-proven SLVS-EC technology.
Stage | Label | Detail |
|---|---|---|
| 1 | Sony IMX742 | Endoscope tip |
Link | SLVS-EC | Up to 5 m of cable |
| 2 | Macnica IMX742 Bridge Chip | Altera Agilex 5 FPGA. One-wire control, I2C, LED strobe, switch inputs |
Link | MIPI CSI-2 | |
| 3 | Host / Console | Your image processor |
A ready-to-design bridge built on Altera Agilex 5 that converts IMX742 SLVS-EC output to MIPI CSI-2 and manages the sensor's bidirectional one-wire control. Pair the IMX742 with processors and consoles that already accept MIPI CSI-2, without building a receiver from scratch.
For teams integrating the sensor directly into their own FPGA design. Macnica SLVS-EC receiver IP supports IMX742 on Altera Agilex 5 and AMD Kintex UltraScale+ devices.
Validate the three challenges that define next-generation single-use endoscopes: cable length, resolution and performance optimization. The Macnica evaluation platform connects the IMX742 to an Altera Agilex 5 FPGA board and outputs MIPI CSI-2 to a Raspberry Pi 4 for display.
Component | Provided by | Description |
|---|---|---|
| Power & Splitter Card | Macnica | Powers the sensor and separates control and data paths. |
| FMC Card | Macnica | Connects the sensor interface to the FPGA board. |
| EQ Card | Macnica (optional) | Signal equalization for long-cable evaluation. |
| Terasic Atum A5 FPGA Board | Macnica | Altera Agilex 5 platform running the Macnica SLVS-EC bridge. |
| Sony IMX742 Sensor | Customer | Sensor or camera module for evaluation. |
Raspberry Pi 4 | Customer | MIPI CSI-2 host for image capture and display. |
Evaluation support begins in November 2026, aligned with IMX742 engineering sample availability. Contact Macnica to plan your evaluation.
A concise introduction to the Macnica IMX742 Bridge Chip, SLVS-EC IP and evaluation platform for single-use endoscopes.
Detailed specifications and the user's manual are available under NDA. Request a meeting with our imaging engineers to review your design requirements.
Our imaging and FPGA engineers help single-use endoscope teams move from evaluation to production. Tell us about your project and a Macnica specialist will follow up.
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