Sony IMX742

Sony packs high sensitivity, low noise and a minimal interface into a sensor small enough for the narrowest scope tips.

3D-stacked architecture

Stacked CMOS image sensor technology delivers high image quality and added functionality in a very small chip.
 

Back-illuminated pixels

A 1.0 µm back-illuminated pixel provides high sensitivity in the low-light conditions inside the body.

Column A/D conversion

Column-parallel analog-to-digital conversion supports high-speed readout with low noise.

Cavity-less WLCSP

Wafer-level chip scale packaging achieves a 1.0 mm x 1.0 mm footprint for ultra-compact camera modules.

Bidirectional one-wire control

A new bidirectional interface saves pins while maintaining stable, high-speed communication with the host.

Long-reach SLVS-EC output

An SLVS-EC based digital output resists noise and drives signals up to 5 m, enabling longer, thinner endoscope designs.
 

Specifications are preliminary and subject to change. Refer to Sony Semiconductor Solutions for the latest information. 
 

The IMX742 puts a new interface at the end of a long cable. Macnica closes the gap between that sensor and your host processor with FPGA-proven SLVS-EC technology.

A ready-to-design bridge built on Altera Agilex 5 that converts IMX742 SLVS-EC output to MIPI CSI-2 and manages the sensor's bidirectional one-wire control. Pair the IMX742 with processors and consoles that already accept MIPI CSI-2, without building a receiver from scratch.

For teams integrating the sensor directly into their own FPGA design. Macnica SLVS-EC receiver IP supports IMX742 on Altera Agilex 5 and AMD Kintex UltraScale+ devices.

• Deep SLVS-EC experience. More than ten years developing SLVS-EC IP for FPGAs and building production camera products around Sony sensors.
• Optimized for the IMX742. FPGA tuning that draws on the sensor's characteristics for long-cable integrity and image quality.
• Less development effort. A reference evaluation platform lets your team validate cable length, resolution and performance before committing to a custom design.
• A clear ecosystem. Sony sensor, Altera FPGA and Macnica IP and engineering support, aligned from evaluation to production.
• Built for medical lifecycles. Licensing options span evaluation, development and production to match the long design and regulatory cycles of medical devices.

Validate the three challenges that define next-generation single-use endoscopes: cable length, resolution and performance optimization. The Macnica evaluation platform connects the IMX742 to an Altera Agilex 5 FPGA board and outputs MIPI CSI-2 to a Raspberry Pi 4 for display.

Evaluation support begins in November 2026, aligned with IMX742 engineering sample availability. Contact Macnica to plan your evaluation.
 

A concise introduction to the Macnica IMX742 Bridge Chip, SLVS-EC IP and evaluation platform for single-use endoscopes.
 

Detailed specifications and the user's manual are available under NDA. Request a meeting with our imaging engineers to review your design requirements.

• SLVS-EC Rx IP Core (Macnica FPGA IP)
• Altera Agilex 5 (FPGA and SoC FPGA)
• Medical & Healthcare (Macnica solutions)
• Sony Image Sensors (full Macnica portfolio)
• Sony IMX742 (Sony Semiconductor Solutions)
• Terasic Atum A5 (FPGA development board)