TQMx130HC COM Express® Compact Type 6 Module

13th Generation Intel® Core™ Processors

 

The TQMx130HC, a COM Express® Compact Type 6 Module powered by 13th Generation Intel® Core™ Processors (code-named Raptor Lake-P / H45 series), stands as a high-performance computing solution tailor-made for FPGA engineers. The module integrates Intel's Performance-Hybrid-Technology, offering a strategic blend of Performance-Cores and Efficient-Cores, which proves invaluable for complex multi-threaded FPGA applications.

 

Within the H45 High-Performance Series, it operates with a 35/45 W TDP*, delivering FPGA engineers up to 14 CPU Cores (6P+8E) and a formidable GPU equipped with 96 Execution Units. This combination is ideal for high-end FPGA applications, where computational prowess is paramount. Notably, it boasts a generous 24 MB Cache, further enhancing its performance capabilities.

 

The module supports flexible DDR5-5200 SO-DIMM memory configurations, accommodating up to 64 GB of memory. This memory versatility is critical for FPGA engineers tackling data-intensive tasks. Moreover, it incorporates AI-Boost with VNNI + DP4a instruction sets, enabling FPGA engineers to optimize inferencing and deep learning tasks.

 

In terms of graphics, it stands out by facilitating four simultaneous 4K high-resolution display outputs or 1x 8K support, catering to advanced visualization needs in FPGA applications. The module also offers a comprehensive range of connectivity options, including 2.5 Gigabit Ethernet, ultra-high-speed PCIe, additional PCIe Gen4 lanes, USB-C, and MIPI-CSI x4 support.

 

Engineered for industrial use and real-time support, it operates under extreme conditions, offering an extended temperature option down to -40°C. Additionally, it ensures a seamless upgrade path through pin-to-pin compatibility with its predecessor, the TQMx120HC.

 

In summary, the TQMx130HC is a powerhouse computing solution designed to meet the exacting demands of FPGA engineers, offering cutting-edge performance, memory flexibility, and extensive connectivity options for a wide range of FPGA applications.

Features

  • Hybrid Performance Technology: Incorporates a blend of Performance-Cores and Efficient-Cores, optimizing multi-threaded performance.

  • High-Performance Processing: Operates with a 35/45 W TDP*, featuring up to 14 CPU Cores and a robust GPU for intense computational tasks.

  • Memory Flexibility: Supports DDR5-5200 SO-DIMM memory configurations up to 64 GB, ideal for data-intensive applications.

  • AI Acceleration: Enhanced inferencing and deep learning capabilities with AI-Boost and VNNI + DP4a instruction sets.

  • Advanced Graphics: Facilitates multiple high-resolution display outputs and versatile connectivity options for demanding visualization needs.

Specifications

CPU
  • Intel Core i7-13800HE (14-Core) 6P+8E / 96 EU / 24 MB, up to 5.0 GHz (Embedded Use Conditions)
  • Intel Core i5-13600HE (12-Core) 4P+8E / 80 EU / 18 MB, up to 4.8 GHz (Embedded Use Conditions)
  • Intel Core i3-13300HE (8-Core) 4P+4E / 48 EU / 12 MB, up to 4.6 GHz (Embedded Use Conditions)
  • Intel Core i7-13800HRE (14-Core) 6P+8E / 96 EU / 24 MB, up to 5.0 GHz (Industrial Use Conditions, Extended Temp.)
  • Intel Core i5-13600HRE (12-Core) 4P+8E / 80 EU / 18 MB, up to 4.8 GHz (Industrial Use Conditions, Extended Temp.)
  • Intel Core i3-13300HRE (8-Core) 4P+4E / 48 EU / 12 MB, up to 4.6 GHz (Industrial Use Conditions, Extended Temp.)
Memory
  • DDR5-5200 - 64 GB (2 SO-DIMMs)
  • EEPROM - 32kbit
Graphics
  • Up to 4 independent 4K display outputs
  • 3x DP/DP++ 1.4a with up to 8K / HDMI
  • 1x eDP 1.4b or dual channel LVDS interface
Communications Interfaces
  • Ethernet - 2.5 Gigabit Ethernet (Intel i226)
  • USB - 4x USB 3.2 Gen2 (up to 10 Gb/s) with USB 3.0 compatibility
  • SATA - 2x  SATA 3.0 (up to 6 Gb/s)
Other Interfaces
  • PCIe - PCIe Gen4 (up to 16 Gb/s per Lane) (x4 + x4)
  • LPC - LPC/eSPI
  • I2C
  • SMBus
  • SPI - SPI (for external UEFI BIOS flash)
  • UART - 2x UART (Rx/Tx) (4-wire optional)
  • GPIO - 8x GPIO through TQ-flexiCFG
  • MIPI - (4 lanes) on extra 22-pin connector (configuration option)
General
  • Dimensions - 95mm x 95mm
  • Plug-in System - COM Express Compact, Type 6
  • Temperature range - Standard temperature: 0°C…+60°C (HE versions)
  • Power supply - 12 V, 5 V Standby (optional), 3 V Battery for RTC
  • Power consumption - Power: typ. 45W / max. TBD
OS
  • Windows 10 / Windows 10 IoT Enterprise
  • Windows 11 (restricted support)
  • Linux

TQ Embedded is known for:

  • Precision German engineering, now with a North America presence
    • Robust industrial products with support
  • Widest portfolio of embedded processing architectures: ARM, x86, PowerPC 
  • Comprehensive in-house process and facilities for true long-life availability
  • Modules with full signal availability (ALL signals available, not just selective groups)
  • In-house full control: design, manufacturing, specialized adaptations
  • Robust baseboard options, production-ready for mounting their SOM products