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Feb 29, 2024Winbond and Mobiveil Collaborate on Ultra-Low Power Applications Winbond HYPERRAM™ delivers low power and low pin count, speeds graphics, and optimizes UI display refresh Mobiveil’s HYPERRAM Controller IP enables SoC Designers to leverage Winbond’s HYPERBUS based HYPERRAM x8/x16 - 250 MHz Memory TAICHUNG, Taiwan –2023-08-30 – Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, and Mobiveil, a fast-growing supplier of Silicon Intellectual Property (SIP), platforms, and IP-enabled design services, today announced a collaboration on a new IP controller targeting various applications such as Automotive, Smart IoT, Industrial, Wearables, TWS, Wireless Headsets, Smart Speakers, and Connectivity.
Feb 27, 2024Artificial intelligence in manual and repetitive assembly When we talk about manual and repetitive assembly of products, we immediately think of Henry Ford and his changes to increase production efficiency, which are still recognized today. Among these changes was the restructuring of the production line, in which each employee carried out a part of the assembly and the equipment moved along a production conveyor belt. This reduction in employee travel optimized activities. However, this division of manual and repetitive assembly activities is often not possible, and the employee needs to carry out the entire process at their bench. They need to master all the stages of the process.
Feb 26, 2024Nisshinbo 3-Phase BLDC Motor Controller IC Tokyo, Japan, December 19th, 2023 – Nisshinbo Micro Devices Inc. has launched the NA7200BE series 3-Phase BLDC Motor Controller IC intended for general pur-poses such as fan and other small BLDC motors.
Jan 31, 2024Lattice Continues Rapid Product Portfolio Expansion Enabling the Next Era of Innovation HILLSBORO, Oregon (USA) – Dec. 5, 2023 – Today at the Lattice Developers Conference, Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, continued its rapid product portfolio expansion with the launch of multiple new hardware and software solutions. Lattice introduced two new innovative mid-range FPGA device families built on the award-winning mid-range Lattice Avant™ platform – Lattice Avant-G and Lattice Avant-X, designed for general purpose and advanced connectivity, respectively. Lattice announced new versions of its applica-tion-specific solution stacks for artificial intelligence (AI), embedded vision, security, and factory automation, each of which are expanded with new features and capabili-ties to help accelerate customer time-to-market. Lattice released updated versions of its software tools and Glance by Mirametrix® computer vision software.
Jan 23, 2024Greenliant Expands eMMC NANDrive™ Portfolio with Highest Endurance EX Series and Value VX Series SSDs SANTA CLARA, CALIF. – DECEMBER 19, 2023 – Greenliant now offers cus-tomers a broader range of reliable eMMC solid state drive (SSD) products with its new budget friendly VX Series. Built in a 153-ball package with high quality 3-bit-per-cell (TLC) NAND, the eMMC NANDrive™ VX Series is available in 16GB, 32GB and 64GB capacities and supports wide temperature (-25 to +85 degrees Cel-sius) operations. It reaches up to 318 / 227 MB/s sequential read/write performance and endurance of 3,000 program-erase (P/E) cycles. See eMMC NANDrive infor-mation at https://bit.ly/eMMC-SSD.
The search for innovating products with an important life cycle meeting our customers’ expectations imposes a partnership with companies having these various aspects.