Press Releases
All
Years
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Jul 25, 2024Digital Earth Leakage Current Detector Nisshinbo Micro Devices Inc., a leading provider of innovative semiconductor solu-tions, is proud to announce the release of its latest product, the NA2201. This state-of-the-art digital earth leakage current detector IC is designed to enhance the safety and reliability of electrical systems by integrating advanced overvoltage and DC cur-rent detection capabilities.
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Jul 16, 2024High-Performance 5V Analog Front End with High Gain PGA Nisshinbo Micro Devices Inc., a leader in advanced semiconductor products, proudly announces the release of its latest innovation, the NA2200 Analog Front End (AFE). Designed to meet the growing demands of high-precision measurement and control applications, it is equipped with cutting-edge features that set a new standard in per-formance and versatility.
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Jul 09, 2024Lattice Introduces New Secure Control FPGA Family with Advan-ced Crypto-Agility and Hardware Root of Trust New Nexus-based MachXO5D-NX FPGAs and Sentry solution stack optimized for evolving security landscape with industry-standard compliant, crypto-agile, and class-leading RoT features
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Jul 02, 2024TDK launches low power MEMS microphone with I²S interface to worldwide distribution TDK Corporation (TSE:6762) announces worldwide distribution of its InvenSense SmartSoundTM T5848 I²S microphones to enable intelligent keyword, voice command and sound detection at ultra-low power. Together with the InvenSense SmartSound T5838, the T5848 I²S microphone supports edge and generative AI systems with its innovative Acoustic Activity Detect (AAD) feature – ideal for IoT applications in-cluding smart watches, TV remotes, home security, augmented reality glasses, action cameras, smart speakers and TWS earbuds.
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Jun 25, 2024Winbond extends its secure flash family with new memory densi-ties, PQC support and secure supply chain management Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today unveils the latest extension of TrustME® Secure Flash W77Q family with 256Mb, 512Mb and 1Gb devices. These ground-breaking secure flash devices are the first in the market implementing Leighton–Micali Signature (LMS) algorithm for PQC (Post Quantum Cryptography), a critical enhancement for securing connected IoT edge devices used in commercial, industrial and server seg-ments.
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Jun 18, 2024Marvell Expands Connectivity Portfolio With New PCIe Retimer Product Line to Scale Compute Fabrics of Accelerated Infrastruc-ture Marvell (NASDAQ:MRVL), a leader in data infrastructure semiconductor solutions, today expanded its connectivity portfolio with the launch of the new Alaska® P PCIe retimer product line built to scale data center compute fabrics inside accelerated servers, general-purpose servers, CXL systems and disaggregated infrastructure. The first two products, 8- and 16-lane PCIe Gen 6 retimers, connect AI accelerators, GPUs, CPUs and other components inside server systems.
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Jun 11, 2024A cutting-edge 1-Cell Li-Ion Battery Protection IC for use with High-Side MOSFETs and more Safety Features Nisshinbo Micro Devices, a leader in innovative semiconductor products, is proud to announce the release of the NB7120ZA. A state-of-the-art single-cell Li-Ion battery protection IC in an ultra-small WLCSP package with advanced features and addition-al safety measures, ideal for a wide range of applications, including hearing aids and wearable devices, smartphones, and handheld data terminals.
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May 23, 2024Genesys Logic Launched USB4® Redriver – BW9906 Genesys Logic, Inc., a leading IC design company in mixed-signal, high-speed I/O technologies, today announced BW9906, its high-performance and cost-effective USB4® Redriver.
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May 21, 2024Announcing ESP32-H4: Low-power SoC with 802.15.4 + Bluetooth 5.4 (LE) Connectivity ESP32-H4 caters to increasing demands for low-power wireless devices, boast-ing significant upgrades in power consumption, connectivity features, and memory expansion capabilities. It represents a significant advancement for Es-pressif's Bluetooth LE chips, transitioning from Bluetooth 5.0 to Bluetooth 5.4.
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May 07, 2024TDK’s next-generation ultrasonic time-of-flight sensor enables new mass market applications in IoT and robotics • The InvenSense SmartSonic™ ICU-10201 high-performance ultrasonic ToF sensor has a powerful embedded processor and extended memory space, allowing complete application algorithms on the chip • Ideal for IoT and robotics applications, the MEMS sensor provides accu-racy required for obstacle avoidance, soft surface identification, and liq-uid level measurements • ICU-10201 is now fully available at multiple distributors worldwide