Automate 2026
Macnica Americas, Inc. | Booth #13018, North Hall
June 22-25, 2026 • McCormick Place, Chicago, IL
Our Approach:
Capture. Process. Communicate.
Every demonstration at Booth #13018 is built around end-to-end system thinking, integrating key supplier technologies into real-world automation applications that resonate with OEMs, system integrators, and decision-makers.
Capture: High-performance imaging and sensing technologies that see the world with precision, from Sony image sensors to iENSO camera modules and STREAL™ semiconductor strain gauges that capture real-time force, load, and torque data.
Process: Edge AI and embedded compute that transforms raw data into real-time intelligence, DeepX NPUs, Infineon MCUs, and TQ system-on-modules working together to power autonomous and intelligent machine behavior.
Communicate: Reliable, low-latency data transport from the edge to the system, powered by Silex wireless and wired connectivity solutions and Connect Tech embedded computing platforms.
Live demos from Macnica Manufacturers and Partners, including:
Infineon - Real3TM Time-of-Flight (ToF) Sensor solution is integrated in robotics to complement the main camera and enables robots to have depth perception for obstacle avoidance and SLAM for navigation. Using the IRS2975C ToF imager and IRS9102C VSCEL driver, high precision and accuracy, independent of lens focal length and pixel size, can be achieved in a small form factor and low cost compared to stereoscopic camera or structured light implementations. The ToF camera sensor is implemented in the “eyes” of the robot head, and what the robot sees is a VGA image of the field of view, with a heat-map view representing the distance of the surrounding objects.
iENSO - Edge AI “factory in a box” for industrial environments requiring fully on-prem vision inspection with a centralized intelligence layer. The solution combines iENSO vision AI cameras and Flex Platform hardware (Ambarella N1-655 based) with BrinqAI AcuSight software to deliver distributed vision AI inspection, centralized production dashboards and management, plus edge VLM-based operator awareness, safety monitoring, and co-pilot capabilities.
Connect Tech - Unlock Real-Time 3D Spatial Intelligence at the Edge - Connect Tech is shaping the future of robotics with advanced Edge AI technology that enables deep advanced environmental understanding. By combining real-time 3D reconstruction from stereo cameras with AI-powered spatial reasoning, robots can recognize and interpret their surroundings with greater accuracy.
Sony - IMX900 Fast Auto Exposure Demo - See how Sony's IMX900 global shutter image sensor automatically adjusts exposure in real time to capture clean, readable barcodes across surfaces with dramatically different reflectance. This on-chip Fast Auto Exposure capability eliminates the need for host processing, making it ideal for high-speed code reading, robot picking, and AGV applications where lighting consistency cannot be guaranteed.
Silex - EP-200Q-EVK platform powered by the Qualcomm Dragonwing™ QCS6490 processor, featuring edge AI applications for robotics and vision-based use cases. A video demonstration will illustrate a robotic arm use case running on the platform, developed using the Edge Impulse platform. Additionally, Silex plans to demonstrate on-device Speech-to-Text (STT) and Large Language Model (LLM) capabilities running directly on the EP-200Q-EVK platform, showcasing advanced AI processing at the edge.
DeepX - DX-M1 Vision AI Demo - Watch DeepX's DX-M1 NPU run live AI inference on a Raspberry Pi 5, with no cloud connection required, including real-time object detection across 36 channels, pose estimation, face recognition, and CLIP-based action recognition that triggers alarms for specific behaviors. Delivering 25 TOPS at under 5W, the DX-M1 demonstrates what truly efficient edge AI looks like when it is purpose-built for vision applications in robotics and intelligent systems.
TQ - TQMxCU1-HPCM AI-Powered Embedded Computing Demo
Watch TQ's TQMxCU1-HPCM COM-HPC Mini module run a live comparison of CPU, GPU, and NPU performance across multiple simultaneous AI workloads, demonstrating how Intel Core Ultra processors deliver high-performance edge computing in a form factor up to 41% smaller than comparable solutions. Built for demanding robotics, industrial automation, and multi-stream vision applications, this demo shows what is possible when processing power and energy efficiency are engineered together from the ground up.
STREAL - Embedded Microstrain Sensing for Robotics - STREAL is Macnica's semiconductor-grade strain sensing platform that gives robots true force, torque, and load awareness by embedding directly into the links, joints, grippers, and frames where mechanical events actually occur - not just at the wrist or load path where traditional sensors miss them. With resolution as low as 0.1 microstrain and integrated SPI output in a thin, low-profile module, STREAL enables higher precision control, faster anomaly detection, and predictive maintenance without adding bulk to your robot design.
Schedule a Meeting