DEEPX

As a pioneer in on-device AI, DEEPX designs high-performance AI semiconductors that maximize efficiency, minimize power usage, and lower costs across a wide range of applications. Built for seamless integration, DEEPX’s advanced chips bring powerful, efficient and low-cost AI capabilities to any device.

 

DEEPX delivers reliable on-device AI through:

  • Thermal Efficiency: Their AI chip maintains high performance while operating between -40° C - 85°C, ensuring reliability in industrial environments.
  • AI Accuracy: It delivers GPU-level AI accuracy using energy-efficient Int-8 precision, crucial for reliable autonomous decision-making in on-device systems.
  • Performance Efficiency: DEEPX’s solution achieves industry-leading AI inference speed per watt, outperforming competitors by more than 2x in real-world conditions.
  • Total Cost of Ownership: With up to 94% savings in electricity costs over five years, DEEPX enables more intelligent and cost-effective AI deployments.

 

Target applications include:

  • Industrial Automation
  • Vision Systems
  • AIoT
  • Retail
  • Robots
  • Surveillance Systems

 

AI Chips

Product NameTypeAI PerformancePower Consumption
DX-M1AI Accelerator25 TOPS3 ~ 5 W
DX-M1M (Q4 2025)AI AcceleratorTBUTBU
DX-V3 (Q4 2025)AI Vision SoC13 TOPSTBU
DX-M2 (Coming Soon)GenAI AcceleratorTBUTBU

 

 

AI Modules

Product NameForm FactorAI PerformancePower Consumption
DX-M1 M.2 LPDDR5x2M.2 M Key 
(22 x 80 mm)
25 TOPS3 ~ 5 W
DX-M1M M.2 2242
 (Q4 2025)
M.2 B+M Key (22 x 42 mm)TBU 
DX-H1 PCIe Card QuattroPCIe Card (167mm x 66.4mm)100 TOPS20 W
DX-H1 PCIe Card Dual V-NPU
(Q4 2025)
Low Profile Slim PCIe Card (167mm x 66.4mm)50 TOPS 
DX-V3 IPCam DX-Cam
(Coming Soon)
TBU13 TOPS 

 

 

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